Wafer Probe Heads
WLCSP test is the applying final test conditions at Wafer Level. WLCSP testing is driven in lowering the cost of test of devices through economical methods of manufacturing and testing. Devices are tested while it is still attached at the wafer and it uses very fine probes. WLCSP testing is to support increasing demands in the low cost, high volume consumer market products that requires smaller devices with greater functionality.